In 3D NAND, the risk of collapse comes during the silicon nitride pullback used to create what looks like a “staircase.” Fig. 5: The Cellesta -i MD 300mm single-wafer clean system targets ≤10nm nodes.

TSMC has already made a system-on-wafer for Tesla's Dojo supercomputer, but this version does not offer the kind of 3D-stacking with logic and memory the company has in mind for the next version ...

Wafer-mapping software has become one of the most popular ... This type of analysis that let users to incorporate different plotting features and spatial patterns to ... The Move to 3D NOR Flash.

Startup Atum Works claims that its nanoscale 3D printing method can easily replace current production flows and reduce chip fabrication costs by 90%, according to a launch post on YCombinator ...

Graphcore has launched the world’s first 3D Wafer-on-Wafer processor - the Bow IPU - which will be at the heart of the company’s next generation Bow Pod AI computer system. The computer system, which ...

Innovative power supply technology for 3D-integrated chips improves energy efficiency and reduces noise, addressing the ...

YMTC, a Chinese 3D NAND maker, is not only ramping up production of flash memory at a rapid pace, but does so using silicon wafers produced in China, according to chief executive and chairman of ...

CEA-Leti will present seven papers on 3D interconnects focused primarily on semiconductor wafer-level platforms at the Electronic Components and Technology Conference (ECTC), May 30-June 2, in Orlando ...