TSMC's N2 (2nm-class) manufacturing technology promises to ... TSMC's quote for a 300-mm wafer process using its N2 technology will exceed $30,000, according to the report. Previously it was ...

In the next year to 18 months, the company intends to ramp up wafer production into the millions, and finalize its manufacturing process ready to roll out into other facilities. The company has ...

In its 2018-2022 Global Wafer Capacity report, IC Insights shows that new manufacturing lines are expected to boost ... assesses the IC industry’s capacity by wafer size, minimum process geometry, ...

The report presents information related to key drivers, restraints, and opportunities with a detailed impact on silicon EPI wafer market analysis. <p ...

This intricate procedure includes manifold stages involving wafer manufacturing, wafer processing, and amalgamation of circuits onto the wafer. The outcome is an IC wafer prepared from the ...

We have already covered its upcoming A16 manufacturing node. The company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and ...

The system is portable, fast, precise, reliable, and easy to set up. The Proforma 300i offers accurate non-contact measurements at vital points throughout the wafer manufacturing process. The system ...

The Recharged Czochralski (RCz) crystal growth process, which enables crucible re-use without powering down between pulls, is increasingly used to produce ingots for both n-type and p-type wafers ...