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Tech giant IBM and Japan’s electronics company Tokyo Electron (TEL) have renewed their partnership to advance semiconductor technologies for the next five years. The collaboration will focus on ...
SK hynix to reportedly change wafer cutting for its next-gen HBM4 memory and 400-layer NAND flash, as they're becoming ...
IBM is currently manufacturing Xilinx's flagship VirtexX-II Pro semiconductor products using a 130nm process on 200mm wafers at IBM facilities in Burlington, Vt. and on 300mm wafers at facilities in ...
New 5-year agreement will focus on semiconductor and chiplet innovation for the age of generative AI ALBANY, N.Y. and TOKYO, April 2, 2025 /PRNewswire/ -- Today, IBM (IBM) and Tokyo Electron (TEL ...
PLAINVIEW, N.Y. - Veeco (NASDAQ:VECO) Instruments Inc. (NASDAQ: VECO) has announced a partnership with IBM (NYSE:IBM) involving its WaferStorm Wet Processing System, which will be used in advanced ...
UPDATE — ClassOne Technology and IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing Provided by GlobeNewswire May 19, 2025, 11:09:18 PM ...
ClassOne Technology Signs JDA with IBM Research ClassOne and IBM to jointly develop innovative solvent solutions for advanced semiconductor and packaging process applications. KALISPELL, Mont., May 19 ...