To repurpose scrap semiconductor wafers for use in silicon-based solar panel manufacturing, IBM Corp. today detailed a reclamation process that was developed at its Burlington, Vermont manufacturing ...
IBM and one of its partners have figured out how to bond two silicon wafers together without requiring a glass carrier, theoretically simplifying the entire process. Share on Facebook (opens in a new ...
KYOTO, Japan--(BUSINESS WIRE)--SCREEN Semiconductor Solutions Co., Ltd. (SCREEN) is preparing to install our first of three key tool sets into the IBM Research (IBM) Albany Nanotech, Semiconductor ...
Mr. Proud, who became a U.S. citizen in 2019, put together a policy paper for the first Trump administration, calling for a ...
DANVERS, Mass. — Ibis Technology Corp., a vendor of silicon-on-insulator (SOI) wafers, said today (January 7, 2003) that it has signed a joint development agreement with IBM Corp. with a view to ...
Today, IBM and Samsung Electronics jointly announced what they said is a breakthrough in semiconductor design utilizing a new transistor architecture that allows more transistors to be packed in an IC ...