NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, ...
Integrated 3- to 6-axis nanopositioning platform with ACS motion control accelerates active alignment processes.
Experience PI’s new piezo wafer stages, granite-based multi-axis systems for thin film metrology, air bearing stages, laser beam steering systems, and sub-nanometer precision piezo stages, backed by ...
PI’s latest 6-axis alignment system is available in one-sided and double-sided configurations, upright for PIC assembly or inverted, for photonics wafer-probing applications. PI’s F-713 6-axis ...
One of the contributors to layer-to-layer overlay in today’s chip manufacturing process is wafer distortion due to thin film deposition. Mismatch in the film specific material parameters (e.g., ...
Every wafer test touch-down requires a balance between a good electrical contact and preventing damage to the wafer and probe card. Done wrong, it can ruin a wafer and the customized probe card and ...
Semiconductor manufacturing depends heavily on the ability of machine-vision systems to correctly locate, identify, and align wafers and circuits for testing. Inaccuracy in any of these activities can ...
It also incorporates a more powerful and flexible controller designed to support future developments in photonics alignment technology. PI’s F-713 6-axis alignment system is available in one-sided and ...
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