Amid intensifying competition in advanced semiconductor packaging, Samsung Electronics is reportedly taking direct control of ...

The Korea Research Institute of Standards and Science has successfully developed a high-quality compound semiconductor ...

The Korea Research Institute of Standards and Science (KRISS, President Ho Seong Lee) has successfully developed a high-quality compound semiconductor material for ultra-sensitive SWIR sensors.

BOE, a leading Chinese manufacturer of LCD and OLED displays, is considering making glass core substrates for next-gen domestic chips.

KRISS has addressed these challenges by developing a new InAsP material, grown on an InP substrate as the light-absorbing ...

India and the Netherlands are exploring collaboration in semiconductor research using lab-grown diamonds. The partnership aims to leverage the traditional trade of diamonds and innovative technology, ...

Glass substrates are also considered the most suitable technology for the application of chiplet packaging, which is seen as a future technology in the semiconductor market. Chiplets allow for ...

Focusses on Advanced IC-Substrates and Next Generation Wafer-Level Packaging ...

As Per the SNS Insider,“The GaN Diamond Semiconductor Substrates Market size was USD 0.0352 billion in 2023 and is expected to reach USD 0.141 Billion by 2032, growing at a CAGR of 16.7% over ...