In the race to develop the next generation of high-performance semiconductor devices, thermal management has emerged as a critical bottleneck. From AI accelerators in hyperscale data centers to RF ...
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Lead-free thin films turn everyday vibrations into electricity
Powerful electronics don't have to come at an environmental cost. Scientists at Osaka Metropolitan University have developed ...
Diamond wire sawing is a critical cutting technology in the semiconductor and photovoltaic industries, employed to slice single-crystal silicon ingots into thin wafers. The process utilises a ...
Device level SiC wafers require a systematic process including single crystal growth, wire cutting, lapping or grinding, and chemical mechanical polishing. SiC wafers have important application value ...
College of Engineering at Seoul National University announced that a research team led by Professor Gwan-Hyoung Lee from the Department of Materials Science and Engineering, in collaboration with the ...
Hongyuan Green Energy said it has produced a first batch of 40 µm ultra-thin monocrystalline silicon wafers at its smart wafer manufacturing base in Baotou, China, marking what it describes as a ...
imec, a Belgium-based research and innovation hub in nanoelectronics and digital technologies, has announced “a significant milestone in silicon photonics” with the successful demonstration of ...
The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...
Researchers from Australian National University and Longi used photoluminescence imaging to analyze dopant distributions in ...
Modern chips are manufactured on slabs of silicon less than a millimeter thick. But semiconductor companies try to slice these silicon wafers thinner and thinner to squeeze more performance out of ...
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