From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

Semiconductor packaging plays a crucial role in modern electronics by protecting the chip, enabling electrical connections, ...

Researchers have demonstrated an integrated optical link on a silicon wafer that exhibits high-speed data transmission with very low power consumption.

Apple might stick to using TSMC's third-generation process node (N3P) for the A20 chips powering the iPhone 18 in 2026.

MILPITAS, Calif., Feb. 13, 2025 /PRNewswire/ -- In the second half of 2024, worldwide silicon wafer demand started to recover from the industry downcycle seen in 2023, the SEMI Silicon ...

Notably, fan-out wafer packaging, a technology used by companies ... which is essential for combining multiple silicon dies ...

The Global Semiconductor Wafer market is projected to grow significantly, from 24,362.2 million in 2025 to 42,987.0 million ...

Silicon wafers can be used in producing chips and ... Foundries are increasingly investing in new advanced packaging techniques, especially silicon substrate-based. Foundry vendors are researching ...

TASMIT Inc. has launched a new inspection system for glass substrates as part of its INSPECTRA® series of semiconductor wafer ...