method instead of silicon ingot cutting for the production of the wafer used for the cell. LT is a technique to transfer a layer of a semiconductor material, often of a wafer-scale size ...
Firstly, a RMB 350 million ($52.8 million) investment will create a new fab with an annual output of 3,000 tonnes of monocrystalline silicon ingots and 122 million pieces of monocrystalline ...
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