Electronic devices have become an indispensable part of our lives in our technology-driven world. These devices owe their existence to a crucial component known as the semiconductor wafer. In this ...

During lapping, a spinning abrasive surface is used to thin wafers from the backside. As the process progresses, precise feedback is required to monitor the amount of material removed and determine ...

When contamination defects surface in advanced nodes, the root cause often spans tools, materials, and handling. This piece outlines how defect mapping, TEM, and SPC data converge to prove causation.

BEIJING, Aug. 31, 2023 /PRNewswire/ -- WiMi Hologram Cloud Inc. (NASDAQ: WIMI) ("WiMi" or the "Company"), a leading global Hologram Augmented Reality ("AR") Technology provider, today announced that ...

“Wafer mass metrology has become increasingly important as semiconductor processes have become more complex and sensitive,” said Microtronic CEO Reiner Fenske in making the announcement. “Today’s fabs ...

GCU is partnering with the Taiwan Semiconductor Manufacturing Co. for a free course that could end in a job offer with TSMC ...

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

Singapore is a key global semiconductor manufacturing hub supporting advanced production for customers across Asia and beyond. This delivery reflects ACM’s continued commitment to serving ...