Electronic devices have become an indispensable part of our lives in our technology-driven world. These devices owe their existence to a crucial component known as the semiconductor wafer. In this ...

During lapping, a spinning abrasive surface is used to thin wafers from the backside. As the process progresses, precise feedback is required to monitor the amount of material removed and determine ...

TAIPEI (Taiwan News) — Grand Process Technology has signed a cooperation agreement with National Taiwan University of Science ...

When contamination defects surface in advanced nodes, the root cause often spans tools, materials, and handling. This piece outlines how defect mapping, TEM, and SPC data converge to prove causation.

BEIJING, Aug. 31, 2023 /PRNewswire/ -- WiMi Hologram Cloud Inc. (NASDAQ: WIMI) ("WiMi" or the "Company"), a leading global Hologram Augmented Reality ("AR") Technology provider, today announced that ...

“Wafer mass metrology has become increasingly important as semiconductor processes have become more complex and sensitive,” said Microtronic CEO Reiner Fenske in making the announcement. “Today’s fabs ...

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...