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ASU-related projects nab $1.2 billion for new research tied to semiconductor packaging
Arizona State University-affiliated research programs and laboratories will receive $1.2 billion in new funding for semiconductor packaging, winning two of four new national awards announced by ...
Benzinga.com24d
Taiwan Semiconductor Projects AI Revenue To Double In 2025, Highlights Advanced Packaging As Growth Driver: Analyst
TSM's 2025 CapEx expected at $38B-$42B, with increased focus on advanced packaging as AI and 3nm tech drive growth. Brand New Membership Level: Benzinga Trade Alerts Taiwan Semiconductor guided ...