The semiconductor front-end equipment market is at the ... Nikon disclosed intentions to introduce exposure machinery for the back-end semiconductor process in fiscal year 2026 (April 2026 to ...

The consortium drives research and development in next-generation semiconductor advanced packaging and back-end processing technologies anchored by a new cutting-edge facility in Silicon Valley.

Taiwan's TSMC has inked a deal with US semiconductor outfit ... the US has focused on front-end chip design and manufacturing ...

This comes as GVT, which makes front-end and back-end equipment in the semiconductor original equipment manufacturer ... such as those in data centres and artificial intelligence. The process has ...