designed to transform the semiconductor landscape with innovative multi-chiplet designs. This UCIe chiplet brings highly customizable, package-level integration with die-to-die interconnect and ...

The work, from researchers in the UB Center for Advanced Semiconductor Technologies, could lead to energy-efficient ...

Summary The UCIe standard, launched in 2022, enhances die-to-die connectivity for multi-die systems. Synopsys' Manuel Mota recently compared UCIe Standard and Advanced in a webinar, highlighting its ...

Nanoelectronics deal with extremely small electronic components—transistors, sensors and circuits that can fit on the tip of a needle. This technology powers our everyday lives through devices such as ...