and IoT Semiconductor Back-End Equipment market is growing due to demand for advanced packaging, testing, and assembly solutions, driven by increasing semiconductor production for AI, 5G ...

Foreign companies and domestic firms alike are investing in testing and packaging chips in Vietnam, signaling the country’s growing role in the $95 billion semiconductor back-end segment ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

Taiwan Semiconductor guides AI revenue to ... advanced node spending is trending down while back-end spending (packaging/testing) is trending up. Shi added that advanced packaging related to ...

Arizona State University-affiliated research programs and laboratories will receive $1.2 billion in new funding for semiconductor packaging ... “will strengthen our end-to-end semiconductor ...

"An ATMP facility is essentially a backend fab facility where testing, packaging and marking of semiconductors are carried out. "This is perhaps the largest back-end semiconductor fab unit in the ...

Tata Projects on Tuesday said that the construction of the US-based chip company Micron Technology’s semiconductor assembly and test facility at Sanand near Ahmedabad will be over by December 2025.

Advanced packaging demands are driving consistent growth in semiconductor material demand, with distributors reporting strong contributions from the sector. Demand for high-end materials is ...

Arizona State University-affiliated research programs and laboratories will receive $1.2 billion in new funding for semiconductor packaging, winning two of four ... and Science Act “will strengthen ...

Tata Projects on Tuesday said the construction of the US-based chip company Micron Technology’s semiconductor assembly and test facility at Sanand near Ahmedabad is going on in full swing. The ...