Brewer Science's new co-CEOs talk about shifts in materials for IC manufacturing, flexible substrates, and the uncertainties ...

and IoT Semiconductor Back-End Equipment market is growing due to demand for advanced packaging, testing, and assembly solutions, driven by increasing semiconductor production for AI, 5G ...

Foreign companies and domestic firms alike are investing in testing and packaging chips in Vietnam, signaling the country’s growing role in the $95 billion semiconductor back-end segment ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

Arizona State University-affiliated research programs and laboratories will receive $1.2 billion in new funding for semiconductor packaging ... “will strengthen our end-to-end semiconductor ...

Taiwan Semiconductor guides AI revenue to ... advanced node spending is trending down while back-end spending (packaging/testing) is trending up. Shi added that advanced packaging related to ...

"An ATMP facility is essentially a backend fab facility where testing, packaging and marking of semiconductors are carried out. "This is perhaps the largest back-end semiconductor fab unit in the ...

The Commerce Department has awarded $1.2 billion to two ASU-related projects and facilities tied to the way semiconductors are protected.

Tata Projects on Tuesday said the construction of the US-based chip company Micron Technology’s semiconductor assembly and test facility at Sanand near Ahmedabad is going on in full swing. The ...