RF SiP technology is an enabling packaging platform for wireless communication, which is constrained by the fact that, today, SiP design is an “expert engineering” process—one that is not scalable as ...

Thanks to advances in circuit miniaturization and systemin- package (SiP) technology, the goals of smaller size and more functionality have become attainable. Thanks to advances in circuit ...

Using a system-in-package (SiP) rather than system-on-chip (SoC) implementation to address product miniaturization requirements can lead to shorter development cycles with minimal capital investment.

JEDEC and OCP (Open Compute Project Foundation) announce new Chiplet Design Kits for EDA use covering four areas: Assembly, Substrate, Material and Test. Basically, they are a way for chiplet builders ...