San Jose, Calif. — Systems-in-package may have a time-to-market advantage over systems-on-chip, but the lack of SiP design tool support could chip away at that edge, say both users and EDA tool ...
The SiP Flow help designers ensure component design success with accurate and systematic analysis of inter-die and package effects Hsinchu, Taiwan -- July. 27, 2009 --Global Unichip Corp. (GUC; TW: ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback