The solution comes in the form of a change in the design methodology for SiP products. A co-design environment that accommodates the RFIC flow and links this schematic-based flow to package ...
San Jose, Calif. — Systems-in-package may have a time-to-market advantage over systems-on-chip, but the lack of SiP design tool support could chip away at that edge, say both users and EDA tool ...
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