Ottawa, Jan. 21, 2025 (GLOBE NEWSWIRE) -- The global panel level packaging market size to calculate USD 11.13 billion by 2033, up from USD 0.59 billion in 2024, expanding at a CAGR of 38.60% from ...

ASU is undertaking particularly innovative work to scale up wafer-level and panel-level packaging – capabilities that currently do not exist for large-scale manufacturing in the US. The largest ...

Manz RDL solutions take a deep dive into panel-level packaging and TGV process. According to Robert Lin, General Manager of Manz Asia, the company latest Redistribution Layer (RDL) process ...

APT’s net profit expanded 24.5 percent to NT$607.62 million during the first three quarters of last year, compared with ...

OSATs from China are moving into fan-out. Several packaging houses are pursuing panel-level fan-out, a low-density technology that promises to lower the cost of fan-out. In total, the overall fan-out ...

Due to capacity constraints, packaging has remained a bottleneck for the Blackwell chips, prompting Nvidia to employ Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips.

(MENAFN- GlobeNewsWire - Nasdaq) The global panel level packaging market size to hit USD 11.13 billion by 2033, growing from USD 0.81 billion in 2025, increasing at 38.60% CAGR from 2025 to 2033.