Ottawa, Jan. 21, 2025 (GLOBE NEWSWIRE) -- The global panel level packaging market size to calculate USD 11.13 billion by 2033, up from USD 0.59 billion in 2024, expanding at a CAGR of 38.60% from ...

For instance, research on fan-out panel-level packaging (FO-PLP) has highlighted the importance of understanding the redistribution layer (RDL) effects on warpage, proposing various modeling ...

The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and prototyping advanced packaging techniques at scale.

Due to capacity constraints, packaging has remained a bottleneck for the Blackwell chips, prompting Nvidia to employ Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips.

This tool supports various panel sizes, including 600 mm x 600 ... properties for a large variety of polymers for wafer-level packaging that are critical for AI and HPC related applications ...

(MENAFN- GlobeNewsWire - Nasdaq) The global panel level packaging market size to hit USD 11.13 billion by 2033, growing from USD 0.81 billion in 2025, increasing at 38.60% CAGR from 2025 to 2033.