Wuhan University’s School of Integrated Circuits has teamed up with China’s top memory chipmaker to overcome US tech curbs.

Samsung has signed an agreement with China’s YMTC to use its bonding technology in the production of 400-layer NAND flash memory.

Micron's NAND business is struggling due to weak data center SSD demand. Read more on what this key memory chipmaker expects for the rest of 2025.

Samsung has signed an agreement with China’s YMTC to use its hybrid bonding tech The move will prevent infringement claims in production of 400-layer NAND US-China trade tensions may also have ...

The company has started mass production of its most advanced 3D NAND chips made up of 232 layers of memory cells. The competition sits close behind.

Micron claims its new 2600 SSDs deliver TLC-like performance while retaining the cost efficiency of QLC NAND thanks to a new ...

The late 1990s saw the widespread introduction of solid-state storage based around NAND Flash. Ranging from memory cards for portable devices to storage for desktops and laptops, the data storage ...

An analyst reported that Micron was able to raise NAND wafer contract prices by 10% in September. This is a positive move following a brutal downturn, but it's not clear that end-market demand has ...

Samsung to release 400-layer NAND chip for AI data centers New BV NAND tech boosts density and minimizes heat buildup Plans for 1,000-layer NAND by 2030 to expand capacity Samsung is working to ...

Prices of DRAM modules and PC SSDs are almost certain to rise as big customers are agreeing to higher prices for flash and DRAM chips.

Micron's revolutionary 232-layer 3D NAND is about to change the storage game, and here's what that means for the future of computing -- personal to the cloud.

Samsung has signed an agreement with China’s YMTC to use its bonding technology in the production of 400-layer NAND flash memory.