The key challenge for disparate multi chip system simulation is to bring a standard interface which allows: Simulating multiple chips which were individually verified with different verification tools ...

This integration of optical chiplets within multi-chip packages, increasingly becoming the norm in high-performance processors, could enable up to 25 times better off-package bandwidth compared to ...

As of July 8, each core of new multi-core AMD or Intel processors ... more compute-intensive CPUs that basically pack multiple chip capabilities on a single processor. Up until now, Redwood ...

The complex multi-chip module design, which integrates two large GPU dies on a single package, further exacerbates the heat management challenges. As deployments scale, with configurations ...

Sophgo drew attention after a chip found on Huawei’s Ascend 910B multi-chip AI system matched one it ordered from Taiwan Semiconductor Manufacturing Co. Sophgo is among numerous companies that ...

May 10 /PRNewswire/-- Inapac Technology, Inc., the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP) applications, today announced a breakthrough solution for ...

TSMC last year suspended shipments to mainland China-based chip designing firm Sophgo after a chip it ordered from the Taiwanese chipmaker was found to match one on Huawei's Ascend 910B multi-chip ...