Intel's semiconductor manufacturing strategy has undergone drastic changes over the past few years, reflecting both ...

Intel was the only other company that held a double-digit share of 300mm capacity at the end of 2012. Assuming Micron is successful in acquiring Elpida in 1H13, the combined 300mm wafer capacity of ...

But the test wafers suggest that Intel is on pace, or maybe even a bit ahead of schedule, for producing 1.8nm-class chips in the middle of this year. If Intel can prove wrong the rumors about it ...

The company uses these systems for research and development purposes, and so far, Intel has processed tens of thousands of wafers using them. Intel installed and started using two High-NA EUV ...

The list of companies with the most 300mm wafer capacity includes DRAM and flash memory suppliers like Samsung, SK Hynix, Toshiba, Micron, Elpida, and Nanya; the industry’s biggest IC manufacturer and ...

If that were not enough, the devices in our key markets are currently manufactured with feature dimensions ranging from above 180nm down to below 28nm using older equipment handling 200mm wafers as ...

TL;DR: Intel announced Lip-Bu Tan as CEO and achieved a milestone by testing its 18A process node wafers at its Arizona fab, marking a significant step for U.S. semiconductor manufacturing.

Up until recently, Intel processed wafers on its 18A production technology at its site near Hillsboro, Oregon, where new manufacturing processes are developed. While the company can volume produce ...

Generally, 200mm silicon wafer supply remains tight. But demand for 300mm silicon wafers is cooling off in some segments, causing supply to move toward equilibrium after a period of shortages. On ...

TechPowerUp, citing Intel’s engineering manager Pankaj Marria, reports that initial 18A wafers are already rolling out from the Arizona plant. The progress, according to ijiwei and Commercial Times, ...