The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

Arizona State University-affiliated research programs and laboratories will receive $1.2 billion in new funding for semiconductor packaging, winning two of four new national awards announced by ...

As the semiconductor industry increasingly moves to chiplets ... should be employed to apply tests pre- and post-packaging. IEEE 1838 is a DFT (design for test) standard for 3D ICs. DFT describes how ...

The Best and Outstanding Session Papers from ECTC 2024: ...

Here is what to know about the research lab, semiconductor packaging and the significance of ASU’s role after Monday's announcement. Arizona State University will host a new national laboratory ...

Arizona State University-affiliated research programs and laboratories will receive $1.2 billion in new funding for semiconductor packaging, winning two of four new national awards announced by the ...