SK hynix to reportedly change wafer cutting for its next-gen HBM4 memory and 400-layer NAND flash, as they're becoming ...

300mm wafers dominate the wafer dicing market driven by growth in AI, 5G, and automotive electronics. Laser dicing leads market due to superior precision, efficiency, and yield, while North ...

Future of Wafer Dicing Saws Market Size, 2023- Trends, Outlook and Growth Opportunities, Market Share, Global Industry Analysis, Insights, Competition, and Forecasts to 2030. The Wafer Dicing Saws ...

Fonon Corporation ’s laser-powered BlackStar Wafer Dicing System helps semiconductor fabricators eliminate defects, distortions, cracks and chipping during wafer dicing.

Lasers play a crucial role in various applications in semiconductor manufacturing, such as laser cutting and slicing. The integration of lasers enhances throughput and improves defect control, leading ...

Most Taiwan-based IC-design companies have continued to cut or delay their wafer start orders with the upstream foundry houses as their order visibility from downstream customers remains dim.

By application, the memory and logic segment accounted for more than three-fifths of the global thin wafer processing and dicing equipment market revenue in 2021, and is projected to retain the ...

Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing.