Wafer capacity growth of 8% forecast for 2018 and 2019 versus 4.8% average yearly growth from 2012-2017. February 12, 2018 -- IC industry wafer capacity, specifically in the memory segment, was ...

High volume 450mm IC wafer fabs not expected until after 2020. April 19, 2016 -- IC Insights recently released its new Global Wafer Capacity 2016-2020 report that provides in-depth detail, analyses, ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates which ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates which ...