The increasing complexity of integrated circuit (IC) designs is straining our traditional design rule checking (DRC) methods. The iterative “construct by correction” approach that worked well for ...

GENIO EVO, an integrated chiplet/package EDA tool from MZ Technologies, addresses thermal and mechanical stress in the pre-layout stage of 3D IC design. Set to be demonstrated at this month’s Chiplet ...

In this post, we’ll look at more advanced technology topics and key design tools that enhance layout productivity. We’ll also explore what might be next for integrated circuit (IC) mask layout design.

High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.