Semiconductor packaging plays a crucial role in modern electronics by protecting the chip, enabling electrical connections, ...

Active interposers with transistors will gradually replace passive interposers, driving the transition to vertical stacking.

New versions of the IC are still being cranked out ... I took a look at two such offerings. LMC555 chip-scale DSBGA package. Dark bars in background are 1 mm ticks on machinist’s rule.

As such, the result is a chip that’s flat to the PCB like an SMD component, but with leads that extend much farther out than any traditional package. Obviously, the body of a DIP chip is still ...

A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in ...