BOE, a leading Chinese manufacturer of LCD and OLED displays, is considering making glass core substrates for next-gen ...

Glass substrates are new entrants in the semiconductor packaging domain, and long-term reliability information is relatively scarce compared with traditional materials like FR4, polyimide or Ajinomoto ...

Samsung Electro-Mechanics is fast-tracking its venture into the semiconductor glass substrate ... on track to start offering advanced packaging on glass substrates in the coming years.

Advanced IC substrates (AICS ... Simply put: are organic substrates up to the challenge? Fig. 1: The industry roadmap for the transition of substrates from organic (top) to glass (bottom) and the path ...

Friday 6 September 2024 BOE reportedly seeks to mass-produce glass substrates for semiconductor packaging in 2026 China-based display solutions supplier BOE Technology has unveiled a roadmap for ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

Competition for an early lead in glass substrates for computer chip manufacturing is heating up, with component firms ...

Fan-out panel level packaging (FOPLP) is a promising semiconductor technology that ... has stepped up the development of its glass substrate offering, eyeing robust demand for ...

One will go to Absolics Inc. in Covington, Georgia, to support the company’s research in glass-core packaging, which focuses on reducing power consumption and the complexity of semiconductor systems ...

This results in semiconductor ... [advanced chips] to packaging, substrates and the integration platform” and the company is “in talks with multiple clients [over glass substrates] with ...