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ASU chosen as site for one of three semiconductor research and development facilities
"Front-end" refers to the process to convert a blank semiconductor wafer to a completed wafer. Advanced packaging allows multiple semiconductor chips to be combined in a way that mitigates heat ...
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BIS Issues Interim Final Rule on Advanced Computing Integrated Circuits, Providing Long-Awaited Guidance on Due Diligence Procedures
On January 15, 2025, the U.S. Department of Commerce’s Bureau of Industry and Security (BIS) released an interim final rule ...