The analysis of stress in cylindrical shell structures underpins the safe and efficient design of critical engineering systems, including pressure vessels, pipelines, aerospace fuselages and offshore ...

Stress analysis of elastic plates containing circular apertures has been a cornerstone of elasticity theory for more than a century. The presence of a hole introduces local stress amplification, ...

The rise of 3D integrated circuits (ICs) and heterogeneous packaging is reshaping how automotive ICs fulfill demanding analog and sensor requirements. Whether for ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...