A high-density dc-dc converter can deliver substantial power, but only if excessive heat is removed by transferring internal heat through a number of material interfaces to a surface exposed to the ...

An ancient, fundamental cooling technique gets a new, more-efficient implementation via an innovative fiber matrix.

Liquid cooling is no longer optional for AI infrastructure, but reliability at connection points is emerging as the next ...

Motivair launched two other CDUs – the MCDU-45 and MCDU-55 – in December. They were the first new products Motivair launched ...

SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced Cadence® Celsius™ Studio, the industry’s first complete AI thermal design and analysis solution for ...

Adding liquid cooling to your existing data center can be complicated, but when done successfully, it effectively cools hotter workloads and keeps critical infrastructure running at peak uptime and ef ...

The U.S. Air Force recently awarded a three-year/$750,000 research grant to the University of Virginia’s (UVA) ExSiTE Lab (Experiments and Simulations in Thermal Engineering) to evaluate the prospect ...

A novel, tested technology for cooling electronic circuitry is available, that is also useful in many other industries. The method is called “thin-cavity fluidic heat exchanger,” abbreviated TCFHE.

Finding appropriate methods of cooling electronics allows engineers, designers and other professionals to prioritize sustainability by finding solutions that will make the products last longer and ...

Thermal, stress and electronics cooling in-design analysis empowers designers to utilize ECAD and MCAD seamlessly for multiphysics simulation of electro-mechanical systems Convergence of FEM and CFD ...