We’ve covered the Tiny Tapeout project a few times on these pages, and while getting your digital IC design out there ... funding MPW (multi-project wafer) runs not in bog standard Silicon ...

High volume 450mm IC wafer fabs not expected until after 2020. April 19, 2016 -- IC Insights recently released its new Global Wafer Capacity 2016-2020 report that provides in-depth detail, analyses, ...

The technique, compatible with existing IC fabrication processes, can deposit multiple layers of 2D graphene using fewer process steps. Destination 2D successfully achieved wafer-scale synthesis ...

The integrative collaboration between wafer foundry and IC design set up a new variable to the entire ... the high cost incurred in additional photomask process for integrating digital logic, memory ...