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It’s a problem that few of us will likely ever face: once you’ve built your first homemade integrated circuit, what do you do next? If you’re [Sam Zeloof], the answer is clear: build better integrated ...
LONDON — Surface Technology Systems plc, a developer of plasma etch systems, has announced that it intends to build a Deep Reactive Ion Etch (DRIE) system suitable for 300-mm diameter wafers. The ...
In this paper, we describe how Oxford Instruments Plasma Technology solution delivers controlled processing of slanted gratings used as light coupler for Augmented Reality waveguide combiners. We ...
There are a few methods in dry etching, such as isotropic radial etching, reactive ion etching, sputter etching, and ion milling. The intricacies of each are beyond the scope of this article, and ...
SANTA CLARA, Calif.–Applied Materials Inc. today announced a new silicon etch chamber for 200- and 300-mm wafer DRAM fabs needing deep-trench etching technology for 100-nm and below process geometries ...