The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and prototyping advanced packaging techniques at scale.
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Computer chip packaging and testing center comes to New Yorkshe signed the Green CHIPS legislation. Currently, the most advanced packaging takes place in Arizona and Texas. Landing a hub at the scale proposed by GlobalFoundries in Malta will drive ...
The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.
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