Chemical Mechanical Polishing (CMP) is a critical process in the semiconductor manufacturing industry, used to achieve flat surfaces on various materials, particularly in the production of ...

Chemical Mechanical Planarization is a process of smoothing wafer surface through exerting the chemical and mechanical polishing on wafer. It is an important step in IC fabrication process. To achieve ...

With this reputation, they are now leading projects with Micron. CAMP’s main projects include Chemical Mechanical Planarization and environmental sustainbility of chip manufacturing.

U.S. Representative Lauren Underwood recently presented Lewis University with a symbolic check of $950,000 to support ...

Prior to coming to SCU, he worked as a process engineer in the Chemical Mechanical Planarization Division of Applied Materials and held postdoctoral positions at the Naval Postgraduate School in ...