Conventional flip-chip bonding methods are limited to pitches of 50μm or 40μm, encountering reliability issues from thermal expansion mismatches causing warpage and die shifting. To address these ...

has announced the development of the AgSn TLP sheet , a sheet-type bonding material designed for die attachment in the manufacturing of power semiconductor packages. Additionally, the AgSn TLP ...

BE Semiconductor Industries N.V. engages in ... hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra-thin, and wafer level ...