As extreme ultraviolet (EUV) lithography moves closer to production, the industry is paying more attention to a problematic phenomenon called mask 3D effects. Mask 3D effects involve the photomask for ...

One of the main challenges in developing semiconductor chip technology is making electronic components smaller and more effective. This difficulty is most noticeable in lithography, which is the ...

This paper describes a theoretical estimation of the geometry of negative epoxy-resist microneedles prepared via inclined/rotated ultraviolet (UV) lithography based on spatially controlled UV exposure ...

Concept of mask/wafer co-optimization by moving the shot with mask and wafer double simulation to minimize wafer error. VSB shot configurations and its corresponding ...

Photolithography involves the selective exposure of a photosensitive material to light, using a UV light source and a collimating optical system to create an image of a patterned mask onto a substrate ...

For years the IC industry has worried about a bevy of issues with the photomask. Mask costs are the top concern, but mask complexity, write times and defect inspection are the other key issues for ...