In 2008, 300mm wafers took over as the industry’s primary wafer size in terms of total surface area used. Furthermore, the number of 300mm wafer fabrication facilities in operation continues to grow ...

The company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.

Capacity for 200mm wafers forecast to slip more than 10 points during same period. July 03, 2013 -- Since 2008, the majority of integrated circuit production has taken place on 300mm wafers. In terms ...